Abstract: EUV and Soft-X-Ray Photonic Integrated Circuits (XPICs) – Overview and First Results at 13.5 nm. Dr. Robert Riedel at EUV Litho 2024

Presented by Dr. Robert Riedel

Abstract
Integrated photonic devices in the extreme ultraviolet (EUV) and soft-X-ray range (XPICs) are a radically new field of research with relevant applications in EUV lithography. We present the fabrication of waveguides and microfluidic devices to generate and manipulate high-brilliance EUV light on-a-chip, thus bringing meterlong set-ups down to centimeter-sized integrated devices. Our work represents a paradigm shift through the synergetic interaction among different disciplines, such as ultrafast lasers, advanced nonlinear optical technologies, femtosecond laser micromachining, fluid dynamics, nanotechnology, and EUV to soft X-rays technology. The presentation will provide an overview about the field as well as insights about the XPIC design and fabrication process. Further, we will show first results of 13.5 nm EUV laser light generation via high-harmonic generation (HHG), coupling an ultrafast laser to a microfluidic waveguide chip. Further, we will demonstrate first examples of actual functional XPIC devices, such as optical filters. We will also discuss future integrated devices, for example, an EUV interferometer-on-a-chip suitable for hyperspectral imaging with nanometer resolution for advanced mask and wafer inspection.

Presenting Author

Robert Riedel graduated in 2010 from Friedrich-Schiller University Jena in Physics with a focus on photonic integrated circuits and femtosecond laser micromachining (Institute of Applied Physics). He received his PhD in 2013 at the University of Hamburg for his work at DESY, developing high-power femtosecond Lasers and EUV/soft- Xray sources and metrology tools. While continuing his work at DESY from 2013 to 2015, he founded Class 5 Photonics with colleagues working in Hamburg, Germany and Stanford, USA. Together with his team, he received several innovation awards.